Fill RFQ Form For DG501AP-2 NSN part by Siliconix Incorporated with NSN 5962-01-077-6118

Part Number DG501AP-2 Specification

Part Number : DG501AP-2 NSN : 5962010776118
Alternate P/N : DG501AP2 Item Name : Microcircuit Memory
Manufacturer : Siliconix Incorporated CAGE Code : 17856
FSC Details : 5962 Microcircuits Electronic NIIN : 010776118

Our customized and comprehensive database helps us to respond to RFQs for various aerospace and aviation parts. If you require Part Number DG501AP-2 (Microcircuit Memory) with NSN 5962010776118 manufactured by Siliconix Incorporated (CAGE Code 17856). The part description for NSN part DG501AP-2 is Microcircuit Memory. Our customized and comprehensive database can provide a response within 15 minutes.

At ASAP Aero Supplies, we are an industry-leading distributor of aerospace and aviation parts with AS9120B, ISO 9001:2015, and FAA AC 0056B accreditations. With locations in the United States, we are well-equipped to cater to your needs.

To help us prioritize your order, kindly provide all requested information in the RFQ form for NSN part DG501AP-2 under FSC 5962 Microcircuits Electronic and NIIN 010776118. Once we receive your request, a dedicated customer service representative will contact you within 15 minutes to discuss it further.

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NSN Information for Part Number DG501AP-2 with NSN 5962-01-077-6118, 5962010776118

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-077-6118

Item Description:

Microcircuitmemory

59620107761180NB5962010128154
CIICHCCESDPMICCriticalityENAC
7BU0
Part NumberISCRNVCRNCCHCCMSDSSADC
Dg501bp31CA

Characteristics Data of NSN 5962-01-077-6118, 5962010776118

MRCCriteriaCharacteristic
ADAQBODY LENGTH0 840 INCHES MAXIMUM
ADATBODY WIDTH0 220 INCHES MINIMUM AND 0 310 INCHES MAXIMUM
ADAUBODY HEIGHT0 140 INCHES MINIMUM AND 0 185 INCHES MAXIMUM
AEHXMAXIMUM POWER DISSIPATION RATING450 0 MILLIWATTS
AFGAOPERATING TEMP RANGE-55 0125 0 DEG CELSIUS
AFJQSTORAGE TEMP RANGE-65 0150 0 DEG CELSIUS
CBBLFEATURES PROVIDEDMONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND WENABLE
CQSJINCLOSURE MATERIALCERAMIC AND GLASS
CQSZINCLOSURE CONFIGURATIONDUAL-IN-LINE
CQWXOUTPUT LOGIC FORMN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
CQZPINPUT CIRCUIT PATTERN8 INPUT
CTFTCASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
CWSGTERMINAL SURFACE TREATMENTSOLDER
CZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC5 0 VOLTS MAXIMUM POWER SOURCE
CZEQTIME RATING PER CHACTERISTIC1500 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT AND 2500 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME HIGH TO LOW LEVEL OUTPUT
CZERMEMORY DEVICE TYPEROM
TESTTEST DATA DOCUMENT15942-0213-1-1150-2 DRAWING THIS IS THE BASIC GOVERNING DRAWING SUCH AS A CONTRACTOR DRAWING ORIGINAL EQUIPMENT MANUFACTURER DRAWING ETC EXCLUDES ANY SPECIFICATION STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNIN
TTQYTERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT

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